The X-9300 is designed to provide high-resolution X-ray imaging for the electronics industry. This versatile system is effective for many applications in the PCB manufacturing process. It can be used to detect integrated circuit chips and semiconductors, including BGA, IGBT, flip chip and PCBA component welding, LED, IC packaging and other industries for high-precision testing.

The X-9300 is designed to provide high-resolution X-ray imaging for the electronics industry. This versatile system is effective for many applications in the PCB manufacturing process. It can be used to detect integrated circuit chips and semiconductors, including BGA, IGBT, flip chip and PCBA component welding, LED, IC packaging and other industries for high-precision testing.

Features of X-ray Inspection Machine for PCBs：

1. CNC program: automatic batch detection of different positions of samples;

2. Array function: automatic batch detection of samples with fixed positions and the same spacing;

3. Length and width measurement: measure the length and width of part of the detection area;

4. Visual navigation interface: precise positioning, X-Y to achieve precise displacement of the joystick;

5. Simulate color: better observe the inspection image;

6. Bubble measurement: One-key measurement of bubble size, void rate, and tin climbing height;

7. Automatically ON/OFF X-RAY light tube to detect samples in batches;

8. Equipped with Japanese X-RAY light tube, the detection accuracy can reach 1um;

9. High-resolution digital X-RAY flat panel;

10. The stage can accommodate a large number of samples of various sizes;

11. Optional 360° rotation of the stage to detect samples;

Parameter Name	Parameter Value
Technology	X-ray visual CNC
Applications	for semiconductors
Sector	for the electronics industry
Other characteristics	measurement high-resolution automatic
Convey weight capacity	20 kg (44 lb)