Super Resolution Broadband Plasma Patterned Wafer Defect Inspection Systems
The 392x Series broadband plasma defect inspection systems support wafer-level defect discovery, yield learning and inline monitoring for ≤7nm logic and leading-edge memory design nodes. With light source technology that produces super resolution deep ultraviolet (SR-DUV) wavelength bands and sensor innovations, the 3920 and 3925 provide high sensitivity capture of unique defect types. The 392x Series also leverages advanced design-aware algorithms, pixel•point™ and nano•cell™, to capture and bin defects in yield-critical pattern locations. With throughput that supports inline monitoring requirements, the 392x Series pairs sensitivity with speed, enabling Discovery at the Speed of Light™, for reduction of the time required to deliver wafer-level data for complete characterization of process issues during development and high volume manufacturing.

Applications
Defect discovery, Hotspot discovery, Process debug, EUV print check, Engineering analysis, Line monitoring, Process window discovery

Parameter Name	Parameter Value
Applications	for wafers
Type	surface defect