The Firefly inspection series provides an automated inspection solution for high performance applications like FPGA, CPU/GPU and networking servers in addition to applications with low I/O counts: IC drivers, RF transceivers, wireless connectivity and MEMS.

Product Overview

The platform, configurable for either wafer (round) or panel (rectangular) substrates, offers multiple imaging modes, including Onto Innovation’s patented Clearfind® Technology, a technique for enabling a large process window to detect residue defects on metal and metal defects on organic layers. The combination of substrate flexibility, defect sensitivity and metrology in a single platform reduces capital investment requirements and provides a reliable pathway to transition from wafer to panel-based processes for applications requiring high I/O counts and multiple-chip integration, such as SoC with memory, wireless module and wide I/O memory.

Integration with Onto Innovation’s Discover Defect software quickly turns defect data into actionable process control, improves classification and reduces manual review. It enables our customers to develop, learn and analyze new processes reliably while significantly improving their product delivery time to market.

Applications

Fan-out Wafer Level Packaging (FOWLP) / Fan-out Panel Level Packaging (FOPLP)
2.5D/Interposers
Embedded Die/Embedded Interposer
3DIC
MEMS
Image Sensors (CIS)
Front-end Macro for Advanced IC nodes

Parameter Name	Parameter Value
Applications	for wafers
Sector	industrial, for the packaging industry, multi-function
Other characteristics	defect automated