Microscope optics for the inspection of electronic boards and tiny components
The newly developed Microscope lenses are especially designed for thermal inspection of electronic boards and analyses of small chip level components down to 28 μm. The distance between the measurement object and the camera can vary between 80 and 100 mm.

Important specifications

• Analysis of small chip level components down to 28 μm
• Hands-free operation for simultaneous testing and IR imaging
• Exchangeable, focusable lenses for most flexible use of the camera
• With a Temperature resolution (NETD) of 80 mK

640x480 px @ 32 Hz/ 640x120 px @ 125 Hz

Lens: f=44 mm/ 12° x 9° lens/ Min. spot (IFOV): 28 μm

Temperature range: -20-100 °C/ 0-250 °C/ (20)150-900 °C

Scope of supply:

Thermal imaging camera optris PI 640i
• Microscope optics (MO44)
• Microscope stand
• Standard USB cable (1 m )
• Standard process interface
• Manual optris PI camera
• Rugged outdoor transport case
• Software package optris PIX Connect on USB flash drive

Technical specifications optris PI Microscope kit

• Minimum spot size: PI 640i: 28 μm
• Microscope optics (FOV):
PI 640i 12° x 9° (F=1.1) / f= 44 mm
• Working distance: 80 – 100 mm
• Temperature range (scalable):
–20 … 100 °C, 0 … 250 °C, 150 … 900 °C
• PI 640i FPA,
640 x 480 pixels @ 32 Hz
640 x 120 pixels @ 125 Hz
• Spectral range 8 – 14 μm
• System accuracy (at ambient temperature 23 ± 5°C): ±2 °C or ±2 % , whichever is greater
• Ambient derating: ± 0,05 %/K 1)
• Temperature resolution (NETD)
• PI 640i: 80 mK
• PC interface: USB 2.0
• Standard process interface (PIF)
0–10 V input, digital input (max. 24 V), 0–10 V output

Parameter Name	Parameter Value
Type	macro
Technical applications	measuring inspection for microscopy for micro-imaging applications for process monitoring compact for research for thermal analysis
Other characteristics	high-resolution IR