Ultra-precision fine gluing control, suitable for occasions with extremely high requirements on dispensing precision.

Helping the semiconductor and precision electronic component manufacturing equipment to realize time precision and productivity jump, realize real-time feedback and compensation of pressure changes, realize fast-paced, highly-stable and ultra-fine dispensing; simple operation and easy maintenance, and rich supporting components and process solutions.

For such process applications as semiconductor chip packaging and MEMS in which solder paste/silver paste is used to achieve conductive connection, common valves have problems such as low efficiency or high maintenance costs for consumables. Especially, mainstream 5# and 6# solder balls are easily broken by shock and thus block the nozzle.

When a conventional pneumatic dispensing controller is used in the above process applications, its slow output pressure response and low pressure stability, etc. lead to relatively poor dispensing consistency.

The KDC series controller with high-precision needles can perfectly solve the above problems.

Automatic Level Compensation
The deviation of glue amount caused by the level difference is eliminated, realizing stable dispensing and reducing poor production process.

Automatic Negative Pressure Compensation
The automatic suction pressure control can effectively prevent glue dripping and help eliminate bubbles to ensure stable dispensing.

Automatic Remaining Amount Warning
By accurately detecting the remaining glue amount in the syringe and comparing it with the set threshold, you are reminded to replace the syringe in time to prevent glue shortage.

Parameter Name	Parameter Value
Other characteristics	high-precision