Hand-guided system for fast inspection of hidden solder joints

Compact, portable video microscope for inspecting solder joints in electronics manufacturing. It is designed for optical inspection and digital image recording as well as measurement tasks on solder joints of ball grid array (BGA), μBGA, CSP and flip chip devices.

Mobile inspection system with two quick-change objectives (depending on equipment):
90° BGA optics (approx. 280 µm gap)
0° macro zoom inspection optics
Fast, hand-guided inspection of hidden solder joints
Integrated, dimmable LED illumination
N-MOS color camera 5 megapixel, with USB connection
Additional LED fiber light included with BGA optics
Ideal for inspection at constantly changing locations and for servicing
Ersa ImageDoc v3 inspection software (basic version) included

High flexibility and speed with handheld inspection of BGA, µBGA, CSP, FlipChip, CGA and step-through on THT connections. Enables evaluation of heel fills on QFP, SOIC and other gull-wing terminated devices, wetting length and internal wetting on PLCC and J-terminated devices.

Parameter Name	Parameter Value
Technology	digital optical
Type	soldering BGA video
Other characteristics	portable