About
Hand-guided system for fast inspection of hidden solder joints
Compact, portable video microscope for inspecting solder joints in electronics manufacturing. It is designed for optical inspection and digital image recording as well as measurement tasks on solder joints of ball grid array (BGA), μBGA, CSP and flip chip devices.
• Mobile inspection system with two quick-change objectives (depending on equipment):
• 90° BGA optics (approx. 280 µm gap)
• 0° macro zoom inspection optics
• Fast, hand-guided inspection of hidden solder joints
• Integrated, dimmable LED illumination
• N-MOS color camera 5 megapixel, with USB connection
• Additional LED fiber light included with BGA optics
• Ideal for inspection at constantly changing locations and for servicing
• Ersa ImageDoc v3 inspection software (basic version) included
High flexibility and speed with handheld inspection of BGA, µBGA, CSP, FlipChip, CGA and step-through on THT connections. Enables evaluation of heel fills on QFP, SOIC and other gull-wing terminated devices, wetting length and internal wetting on PLCC and J-terminated devices.
• Dimensions (LxWxH) mm: 114 x 36 x 51 (without cable)
• Weight in g: 210
• Principle: integrated optical system with built-in camera and LED light source
• Design: plastic, built-in lens 3 mm field of view, light controller integrated (light generation in optics)
• Light control: potentiometer (0-100%)
• Backlight characteristics: cold light LED illumination (option), separately hand-held, with light brush and light intensity adjustment
PARAMETERS
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for PCB
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