Inspection systems for fast inspection of hidden solder joints

Versatile. Designed for optical inspection and digital image acquisition - including measurement of solder joints on BGAs and other SMT components. The field of application includes visual inspection of components on PCBs in SMT or THT in general, but also visual inspection of LP areas or solder paste prints.

Inspection system with two quick-change objectives:
90° BGA optics (approx. 280 µm gap)
0° macro zoom inspection optics
Fast inspection of hidden solder joints
Integrated, dimmable LED illumination
N-MOS color camera 5 megapixel, with USB connection
Additional LED fiber light or LED light source with gooseneck and light fan
Ideal for stationary inspection
Ersa ImageDoc v3 inspection software (basic version) included

High flexibility and speed with hand-held inspection of BGA, µBGA, CSP, FlipChip, CGA and step-through on THT connections. Enables evaluation of heel fills on QFP, SOIC and other gull-wing terminated devices, wetting length and internal wetting on PLCC and J-terminated devices.

Dimensions (WxDxH) in mm: 500 x 520 x 400
Weight in kg: 5
Design: die-cast aluminum, Z-axis with quick/fine adjustment on fixture for ERSASCOPE inspection optics
Version antistatic (y/n): yes
Connections: Fiber optic light guide with LEMO connector for ERSASCOPE optics and 15 mm connector for light source, additional 1,000 mm gooseneck light guide for light brush, integrated USB 2.0 camera connection cable (USB-A/Mini-USB)

Parameter Name	Parameter Value
Technology	camera optical
Other characteristics	high-resolution computer-controlled