About
Inspection systems for fast inspection of hidden solder joints on large printed circuit boards
Versatile. Designed for optical inspection and digital image acquisition - including measurement of solder joints on BGAs and other SMT components. The field of application includes visual inspection of components on PCBs in SMT or THT in general, but also visual inspection of LP areas or solder paste prints.
Inspection system with two quick-change objectives:
90° BGA optics (approx. 280 µm gap)
0° macro zoom inspection optics
Fast inspection of hidden solder joints
Integrated, dimmable LED illumination
N-MOS color camera 5 megapixel, with USB connection
Additional LED fiber light or LED light source with gooseneck and light fan
Ideal for stationary inspection
Ersa ImageDoc v3 inspection software (basic version) included
PARAMETERS
| Parameter Name | Parameter Value |
|---|---|
| Technology |
|
| Type |
for quality control
|
| Other characteristics |
computer-controlled
|
