For the mid stream wafer manufacturing enterprises and downstream packaging and testing enterprises in the semiconductor industry chain, a multi-channel bright and dark field parallel detection system developed independently is adopted to detect the appearance defects of semiconductor wafers and grains with graphics.

Product advantages:

Available in a variety of sizes
This equipment can be used for 4-8 inch patterned wafers

Can detect a variety of defects
Detect defects such as scratch, back collapse, color difference, crack, scratch, metal residue and metal loss

High precision resolution
System resolution: 0.2-0.8 μ m

Fast detection speed
Patterned wafer: 15 minutes / wafer when the number of defects is less than 200

Parameter Name	Parameter Value
Technology	camera
Operational mode	automatic
Applications	for wafers
Type	for defect detection for wafers